Lead frame, semiconductor module and motor driver

The utility model discloses a lead frame, a semiconductor module and a motor driver. The lead frame comprises four chip carrying areas, the four chip carrying areas are arranged in an array, and the chip carrying areas are used for placing power device chips; wherein each chip carrying area is correspondingly provided with three pins, and the three pins comprise a first pin and a second pin which are separately arranged with the chip carrying area, and a third pin which is integrally arranged with the chip carrying area. The utility model aims to reduce the complexity of design and production of the semiconductor power chip. 本实用新型公开一种引线框架、半导体模块和电机驱动器。引线框架包括四个载片区，四个载片区呈阵列设置，载片区用于放置功率器件芯片；其中，每一载片区对应设置有三个引脚，三个引脚包括与载片区分立设置的第一引脚和第二引脚，以及与载片区一体设置的第三引脚。本实用新型旨在降低半导体功率芯片设计和生产的复杂度。