Machining device of supporting pad for polishing head

The utility model provides a machining device of a supporting pad for a polishing head. The machining device comprises an upper bottom plate, an upper pressing plate, a lower pressing plate and a lower bottom plate which are sequentially and concentrically arranged from top to bottom. The upper bottom plate and the lower bottom plate are rectangular; the upper pressing plate and the lower pressing plate are circular; the upper bottom plate and the lower bottom plate are connected through spring guide columns. A cylindrical stamping tool is arranged on the lower bottom surface of the upper pressing plate; and a groove for accommodating a stamping tool is formed in the upper bottom surface of the lower pressing plate. The processing device provided by the utility model can avoid generation of flashes and burrs, reduce the risk that the wafer is scratched during grinding, and improve the position accuracy and size accuracy of holes in the support pad. 本实用新型提供了一种抛光头用支撑垫的加工装置，所述加工装置包括由上至下依次同心设置的上底板、上压板、下压板和下底板；所述上