Single-side grinding clamp for wafer
The utility model provides a wafer single-face grinding clamp, and relates to the field of wafer grinding. The wafer single-face grinding clamp comprises a disc-shaped clamp body, abrasion-resistant layers are arranged on the two side faces of the clamp body respectively, and an outer gear ring is a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides a wafer single-face grinding clamp, and relates to the field of wafer grinding. The wafer single-face grinding clamp comprises a disc-shaped clamp body, abrasion-resistant layers are arranged on the two side faces of the clamp body respectively, and an outer gear ring is arranged on the outer periphery of the clamp body. A grinding blind hole and a drainage through hole are formed in the clamp body, and the hole axis of the grinding blind hole and the hole axis of the drainage through hole are parallel to the axis direction of the clamp body; the radial section of the grinding blind hole is in concave-convex fit with the plane outline of a wafer to be ground, an elastic part is arranged at the bottom of the grinding blind hole, and the upper surface of the elastic part is used for being attached to the wafer to be ground; the axial distance between the upper surface of the elastic part and the corresponding side face of the clamp body forms the depth of a blind hole, and the depth o |
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