Rapid temperature switching device capable of meeting semiconductor process requirements

The utility model discloses a rapid temperature switching device capable of meeting semiconductor process requirements, which is applied to the technical field of temperature control equipment and is characterized in that a partition plate is fixedly arranged in a water storage tank and is used for...

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1. Verfasser: ZHANG PINGYUN
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creator ZHANG PINGYUN
description The utility model discloses a rapid temperature switching device capable of meeting semiconductor process requirements, which is applied to the technical field of temperature control equipment and is characterized in that a partition plate is fixedly arranged in a water storage tank and is used for dividing the water storage tank into a high-temperature area and a low-temperature area; a first communication valve and a second communication valve are fixedly arranged in the high-temperature area and the low-temperature area of the water storage tank respectively, a high-temperature inlet connected with a water chilling unit is formed in the first communication valve, and a low-temperature outlet used for providing cooled fluid for the water chilling unit is formed in the second communication valve. A communicating pipeline is arranged between the first communicating valve and the second communicating valve, and a control valve is arranged on the communicating pipeline; the temperature control circuit has the t
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN220750545UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN220750545UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN220750545UU3</originalsourceid><addsrcrecordid>eNqNyj0KwkAQhuE0FqLeYbAXQjR4gKBYWYgBu7BOvsSF7I87s3p9ETyA1Vs877y4XUy0PSlcRDKaE0jeVvlh_Ug9XpZBbKK5T6AwkAP0KwJnOfg-s4ZEMQWGCCU8s01w8CrLYjaYSbD6dVGsj4drc9oghg4SDcNDu-ZcVeW-Lutd3bbbv6YPnbI8NQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Rapid temperature switching device capable of meeting semiconductor process requirements</title><source>esp@cenet</source><creator>ZHANG PINGYUN</creator><creatorcontrib>ZHANG PINGYUN</creatorcontrib><description>The utility model discloses a rapid temperature switching device capable of meeting semiconductor process requirements, which is applied to the technical field of temperature control equipment and is characterized in that a partition plate is fixedly arranged in a water storage tank and is used for dividing the water storage tank into a high-temperature area and a low-temperature area; a first communication valve and a second communication valve are fixedly arranged in the high-temperature area and the low-temperature area of the water storage tank respectively, a high-temperature inlet connected with a water chilling unit is formed in the first communication valve, and a low-temperature outlet used for providing cooled fluid for the water chilling unit is formed in the second communication valve. A communicating pipeline is arranged between the first communicating valve and the second communicating valve, and a control valve is arranged on the communicating pipeline; the temperature control circuit has the t</description><language>chi ; eng</language><subject>BLASTING ; COLD ROOMS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ; HEAT PUMP SYSTEMS ; HEATING ; ICE-BOXES ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; REFRIGERATION OR COOLING ; REFRIGERATORS ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240409&amp;DB=EPODOC&amp;CC=CN&amp;NR=220750545U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240409&amp;DB=EPODOC&amp;CC=CN&amp;NR=220750545U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG PINGYUN</creatorcontrib><title>Rapid temperature switching device capable of meeting semiconductor process requirements</title><description>The utility model discloses a rapid temperature switching device capable of meeting semiconductor process requirements, which is applied to the technical field of temperature control equipment and is characterized in that a partition plate is fixedly arranged in a water storage tank and is used for dividing the water storage tank into a high-temperature area and a low-temperature area; a first communication valve and a second communication valve are fixedly arranged in the high-temperature area and the low-temperature area of the water storage tank respectively, a high-temperature inlet connected with a water chilling unit is formed in the first communication valve, and a low-temperature outlet used for providing cooled fluid for the water chilling unit is formed in the second communication valve. A communicating pipeline is arranged between the first communicating valve and the second communicating valve, and a control valve is arranged on the communicating pipeline; the temperature control circuit has the t</description><subject>BLASTING</subject><subject>COLD ROOMS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>ICE-BOXES</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>REFRIGERATION OR COOLING</subject><subject>REFRIGERATORS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyj0KwkAQhuE0FqLeYbAXQjR4gKBYWYgBu7BOvsSF7I87s3p9ETyA1Vs877y4XUy0PSlcRDKaE0jeVvlh_Ug9XpZBbKK5T6AwkAP0KwJnOfg-s4ZEMQWGCCU8s01w8CrLYjaYSbD6dVGsj4drc9oghg4SDcNDu-ZcVeW-Lutd3bbbv6YPnbI8NQ</recordid><startdate>20240409</startdate><enddate>20240409</enddate><creator>ZHANG PINGYUN</creator><scope>EVB</scope></search><sort><creationdate>20240409</creationdate><title>Rapid temperature switching device capable of meeting semiconductor process requirements</title><author>ZHANG PINGYUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220750545UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>COLD ROOMS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>ICE-BOXES</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>REFRIGERATION OR COOLING</topic><topic>REFRIGERATORS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG PINGYUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG PINGYUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Rapid temperature switching device capable of meeting semiconductor process requirements</title><date>2024-04-09</date><risdate>2024</risdate><abstract>The utility model discloses a rapid temperature switching device capable of meeting semiconductor process requirements, which is applied to the technical field of temperature control equipment and is characterized in that a partition plate is fixedly arranged in a water storage tank and is used for dividing the water storage tank into a high-temperature area and a low-temperature area; a first communication valve and a second communication valve are fixedly arranged in the high-temperature area and the low-temperature area of the water storage tank respectively, a high-temperature inlet connected with a water chilling unit is formed in the first communication valve, and a low-temperature outlet used for providing cooled fluid for the water chilling unit is formed in the second communication valve. A communicating pipeline is arranged between the first communicating valve and the second communicating valve, and a control valve is arranged on the communicating pipeline; the temperature control circuit has the t</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
recordid cdi_epo_espacenet_CN220750545UU
source esp@cenet
subjects BLASTING
COLD ROOMS
COMBINED HEATING AND REFRIGERATION SYSTEMS
COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS
HEAT PUMP SYSTEMS
HEATING
ICE-BOXES
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
REFRIGERATION OR COOLING
REFRIGERATORS
WEAPONS
title Rapid temperature switching device capable of meeting semiconductor process requirements
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T21%3A34%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHANG%20PINGYUN&rft.date=2024-04-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN220750545UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true