Heat dissipation substrate of power module

A heat dissipation substrate of a power module comprises a heat dissipation substrate body, a plurality of chip welding areas are arranged on the upper surface of the heat dissipation substrate body and used for welding chips respectively, a plurality of heat dissipation fins are arranged on the lower surface of the heat dissipation substrate body, and the chip welding areas are bosses integrally formed on the surface of the heat dissipation substrate body. A heat dissipation concave cavity with a cavity opening in the top is formed in the boss, the heat dissipation concave cavity is filled with a material body with three-dimensional pores and filled with cooling liquid, and the cavity opening of the heat dissipation concave cavity is covered and sealed by a cover plate to form a closed heat dissipation cavity. 一种功率模块的散热基板，包括散热基板，所述散热基板的上表面设置多个芯片焊接区，各芯片焊接区分别用于焊接芯片，所述散热基板的下表面设有若干散热翅片，所述芯片焊接区为散热基板表面一体成型的凸台，所述凸台上设置顶部为腔口的散热凹腔，所述散热凹腔中填充具有三维孔隙的材料体和注入冷却液，散热凹腔的腔口用盖板盖住密封形成密闭的散热腔。