Heat dissipation substrate for power module

A heat dissipation substrate for a power module comprises a heat dissipation substrate, the upper surface of the heat dissipation substrate is provided with a plurality of side-by-side chip areas, a plurality of chips are welded in each chip area, the lower surface of the heat dissipation substrate is provided with a heat dissipation fin area composed of a plurality of columnar fins, and the heat dissipation fin area comprises a core heat dissipation fin area. A plurality of core heat dissipation fin areas are arranged, the core heat dissipation fin areas are in one-to-one correspondence with the chip areas in position, the turbulent flow heat dissipation fin areas are arranged between every two adjacent core heat dissipation fin areas, the diversion heat dissipation fin areas are located on the two sides of the core heat dissipation fin areas and the turbulent flow heat dissipation fin areas, and the turbulent flow heat dissipation fin areas and the diversion heat dissipation fin areas are in one-to-one corr