Improved heat dissipation structure applied to lamp
The utility model belongs to the technical field of down lamp heat dissipation, and particularly relates to an improved heat dissipation structure applied to a lamp. The LED lamp comprises an integrated radiator, a radiator boss, an isolation bottom shell, a radiating communication hole, an insulati...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HUANG GUIQUAN YANG XIAOXIANG LIU KEPING |
| description | The utility model belongs to the technical field of down lamp heat dissipation, and particularly relates to an improved heat dissipation structure applied to a lamp. The LED lamp comprises an integrated radiator, a radiator boss, an isolation bottom shell, a radiating communication hole, an insulation heat conduction pad and an aluminum substrate. An isolation bottom shell is fixedly embedded in the lower end of the integrated radiator, a heat dissipation communication hole is formed in the middle of the isolation bottom shell, the heat dissipation communication hole is embedded into a radiator boss on the lower surface of the integrated radiator, an aluminum substrate is fixed in the isolation bottom shell, and a heating area of the aluminum substrate is attached to the radiator boss. And an insulating heat-conducting pad is filled between the two. A heat dissipation mechanism of a traditional down lamp is improved, a boss embedding mode is adopted to be directly attached to a heating substrate, the heat con |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN220728180UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN220728180UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN220728180UU3</originalsourceid><addsrcrecordid>eNrjZDD2zC0oyi9LTVHISE0sUUjJLC7OLEgsyczPUyguKSpNLiktSlVILCjIyQQqKclXyEnMLeBhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGBuZGFoYWBqGhxkQpAgCKXC2W</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Improved heat dissipation structure applied to lamp</title><source>esp@cenet</source><creator>HUANG GUIQUAN ; YANG XIAOXIANG ; LIU KEPING</creator><creatorcontrib>HUANG GUIQUAN ; YANG XIAOXIANG ; LIU KEPING</creatorcontrib><description>The utility model belongs to the technical field of down lamp heat dissipation, and particularly relates to an improved heat dissipation structure applied to a lamp. The LED lamp comprises an integrated radiator, a radiator boss, an isolation bottom shell, a radiating communication hole, an insulation heat conduction pad and an aluminum substrate. An isolation bottom shell is fixedly embedded in the lower end of the integrated radiator, a heat dissipation communication hole is formed in the middle of the isolation bottom shell, the heat dissipation communication hole is embedded into a radiator boss on the lower surface of the integrated radiator, an aluminum substrate is fixed in the isolation bottom shell, and a heating area of the aluminum substrate is attached to the radiator boss. And an insulating heat-conducting pad is filled between the two. A heat dissipation mechanism of a traditional down lamp is improved, a boss embedding mode is adopted to be directly attached to a heating substrate, the heat con</description><language>chi ; eng</language><subject>BLASTING ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; NON-PORTABLE LIGHTING DEVICES ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; SYSTEMS THEREOF ; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240405&DB=EPODOC&CC=CN&NR=220728180U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240405&DB=EPODOC&CC=CN&NR=220728180U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG GUIQUAN</creatorcontrib><creatorcontrib>YANG XIAOXIANG</creatorcontrib><creatorcontrib>LIU KEPING</creatorcontrib><title>Improved heat dissipation structure applied to lamp</title><description>The utility model belongs to the technical field of down lamp heat dissipation, and particularly relates to an improved heat dissipation structure applied to a lamp. The LED lamp comprises an integrated radiator, a radiator boss, an isolation bottom shell, a radiating communication hole, an insulation heat conduction pad and an aluminum substrate. An isolation bottom shell is fixedly embedded in the lower end of the integrated radiator, a heat dissipation communication hole is formed in the middle of the isolation bottom shell, the heat dissipation communication hole is embedded into a radiator boss on the lower surface of the integrated radiator, an aluminum substrate is fixed in the isolation bottom shell, and a heating area of the aluminum substrate is attached to the radiator boss. And an insulating heat-conducting pad is filled between the two. A heat dissipation mechanism of a traditional down lamp is improved, a boss embedding mode is adopted to be directly attached to a heating substrate, the heat con</description><subject>BLASTING</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-PORTABLE LIGHTING DEVICES</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>SYSTEMS THEREOF</subject><subject>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2zC0oyi9LTVHISE0sUUjJLC7OLEgsyczPUyguKSpNLiktSlVILCjIyQQqKclXyEnMLeBhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGBuZGFoYWBqGhxkQpAgCKXC2W</recordid><startdate>20240405</startdate><enddate>20240405</enddate><creator>HUANG GUIQUAN</creator><creator>YANG XIAOXIANG</creator><creator>LIU KEPING</creator><scope>EVB</scope></search><sort><creationdate>20240405</creationdate><title>Improved heat dissipation structure applied to lamp</title><author>HUANG GUIQUAN ; YANG XIAOXIANG ; LIU KEPING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220728180UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-PORTABLE LIGHTING DEVICES</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>SYSTEMS THEREOF</topic><topic>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG GUIQUAN</creatorcontrib><creatorcontrib>YANG XIAOXIANG</creatorcontrib><creatorcontrib>LIU KEPING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG GUIQUAN</au><au>YANG XIAOXIANG</au><au>LIU KEPING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Improved heat dissipation structure applied to lamp</title><date>2024-04-05</date><risdate>2024</risdate><abstract>The utility model belongs to the technical field of down lamp heat dissipation, and particularly relates to an improved heat dissipation structure applied to a lamp. The LED lamp comprises an integrated radiator, a radiator boss, an isolation bottom shell, a radiating communication hole, an insulation heat conduction pad and an aluminum substrate. An isolation bottom shell is fixedly embedded in the lower end of the integrated radiator, a heat dissipation communication hole is formed in the middle of the isolation bottom shell, the heat dissipation communication hole is embedded into a radiator boss on the lower surface of the integrated radiator, an aluminum substrate is fixed in the isolation bottom shell, and a heating area of the aluminum substrate is attached to the radiator boss. And an insulating heat-conducting pad is filled between the two. A heat dissipation mechanism of a traditional down lamp is improved, a boss embedding mode is adopted to be directly attached to a heating substrate, the heat con</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN220728180UU |
| source | esp@cenet |
| subjects | BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS |
| title | Improved heat dissipation structure applied to lamp |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T05%3A30%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUANG%20GUIQUAN&rft.date=2024-04-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN220728180UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |