Improved heat dissipation structure applied to lamp

The utility model belongs to the technical field of down lamp heat dissipation, and particularly relates to an improved heat dissipation structure applied to a lamp. The LED lamp comprises an integrated radiator, a radiator boss, an isolation bottom shell, a radiating communication hole, an insulation heat conduction pad and an aluminum substrate. An isolation bottom shell is fixedly embedded in the lower end of the integrated radiator, a heat dissipation communication hole is formed in the middle of the isolation bottom shell, the heat dissipation communication hole is embedded into a radiator boss on the lower surface of the integrated radiator, an aluminum substrate is fixed in the isolation bottom shell, and a heating area of the aluminum substrate is attached to the radiator boss. And an insulating heat-conducting pad is filled between the two. A heat dissipation mechanism of a traditional down lamp is improved, a boss embedding mode is adopted to be directly attached to a heating substrate, the heat con