Wafer single-side electroplating tool

The utility model relates to a wafer single-side electroplating tool. The tool comprises a substrate; the conducting strip is attached to the side face of the substrate, and an exposed conducting disc used for loading a wafer is arranged on the conducting strip; the wafer is attached to the outer si...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XUE SHUNLI, QI JIANGUO, MA YINHU, YAN BIN, ZHANG HUAPING, ZANG YUBING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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