Wafer single-side electroplating tool

The utility model relates to a wafer single-side electroplating tool. The tool comprises a substrate; the conducting strip is attached to the side face of the substrate, and an exposed conducting disc used for loading a wafer is arranged on the conducting strip; the wafer is attached to the outer side surface of the conductive disc. And the wafer is sealed and adhered to the outer side surface of the conducting strip through the peripheral wax. The number of the conducting strips is two, the conducting strips are attached to the two side faces of the substrate respectively, and wafers are attached to the outer side faces of the two conducting strips. And a heating sheet is embedded in the substrate. The heating sheet comprises a heat conduction ring, and the heat conduction ring is located under the wafer and is communicated with the electric heating device through a heat conduction strip. As an electroplating tool clamp of the wafer, the single-face electroplating effect of the wafer can be achieved in the w