Electronic packaging device

The utility model provides an electronic packaging device, which comprises a lead frame, the lead frame is provided with a #-shaped or Chinese character'wang '-shaped mounting groove, insulating glue is arranged inside and on the surface of the #-shaped or Chinese character'wang'-shaped mounting groove of the lead frame, and the insulating glue and pins of the lead frame form a whole after being solidified. The chip is provided with a chip bonding adhesive DAF film, the chip and the chip bonding adhesive DAF film are baked and then are subjected to scribing separation, the chip subjected to scribing separation is installed on the lead frame, a bonding wire is connected between the chip and the lead frame, the lead frame is provided with a plastic package body used for plastic package of the chip, and the hollow lead frame is coated with insulating glue firstly, so that the chip is subjected to plastic package through the plastic package body. Gaps among the frame pins are filled with insulating glue to form a