Thin film microelectrode based on printed circuit board manufacturing process

The utility model provides a thin-film microelectrode based on a printed circuit board manufacturing process, which specifically adopts a thin-film processing method to modify Pad points on the front surface of a substrate and comprises a working electrode, a reference electrode, an auxiliary electrode and an electrolytic tank, and golden fingers serving as contact points are further modified on the front surface and the back surface of the substrate. Part of the golden fingers are correspondingly connected with the Pad points through leads; and the connection positions of the other part of Pad points are provided with conduction through holes which are correspondingly connected with the golden fingers on the back surface of the substrate through leads. 本实用新型提供了一种基于印制线路板制程工艺的薄膜化微电极，具体采用薄膜化加工方法在所述基板正面修饰Pad点，包括工作电极、参比电极、辅助电极和电解池，基板正面、背面还修饰有作为接触点位的金手指，部分金手指和Pad点通过引线对应相连；另一部分Pad点相连位置设置有导通通孔，通过引线与基板背面的金手指对应相连。