Device for detecting thickness of semiconductor wafer

The utility model provides a semiconductor wafer thickness detection device, and relates to the wafer thickness measurement field, the semiconductor wafer thickness detection device comprises an installation pedestal and a chip placing plate arranged on the installation pedestal, two sides of the chip placing plate are provided with sliding grooves, the inner side walls of the sliding grooves are slidingly connected with clamping members, and the clamping members are connected with the chip placing plate. Through the arrangement of the clamping pieces, an operator can fix a chip through the two clamping pieces during use, after the chip is fixed, the operator can rotate a rotating threaded rod to enable a moving frame to drive a measuring piece to move downwards, and when the measuring piece moves downwards, a measuring contact plate is made to make contact with the top end of the chip; at the moment, the thickness of the chip can be measured under the action of the measuring mechanism such as the reset sprin