Wafer fixing device and wafer coating equipment
The utility model discloses a wafer fixing device and wafer coating equipment, the wafer fixing device comprises a fixing disc and an adsorption device, the fixing disc is used for placing a wafer, and the adsorption device is arranged at the bottom end of the fixing disc; a plurality of notch groov...
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| creator | LI-FENG YILANG GUAN YAZHOU LIU YANG SHI MIN |
| description | The utility model discloses a wafer fixing device and wafer coating equipment, the wafer fixing device comprises a fixing disc and an adsorption device, the fixing disc is used for placing a wafer, and the adsorption device is arranged at the bottom end of the fixing disc; a plurality of notch grooves are formed in the outer side of the edge of the top end of the fixing disc, the notch grooves are evenly distributed in the fixing disc at equal intervals, notches are formed in the edge of the wafer, and the shapes of the notch grooves are matched with the shapes of the notches. The high-density plasma can be uniformly deposited and distributed on the wafer while the generation of the electric arc is avoided, so that the problem of wafer test failure caused by non-uniform deposition of the high-density plasma on the wafer chip is solved, and the coating quality of the wafer and the yield of the wafer are further improved.
本申请公开一种晶圆固定装置及晶圆镀膜设备，包括固定盘和吸附装置，固定盘用于放置晶圆，吸附装置设置于固定盘底端；固定盘的顶端边缘外侧设置有若干缺口槽，若干缺口槽在固定盘上均匀且等距分 |
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本申请公开一种晶圆固定装置及晶圆镀膜设备，包括固定盘和吸附装置，固定盘用于放置晶圆，吸附装置设置于固定盘底端；固定盘的顶端边缘外侧设置有若干缺口槽，若干缺口槽在固定盘上均匀且等距分</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240319&DB=EPODOC&CC=CN&NR=220619099U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240319&DB=EPODOC&CC=CN&NR=220619099U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI-FENG YILANG</creatorcontrib><creatorcontrib>GUAN YAZHOU</creatorcontrib><creatorcontrib>LIU YANG</creatorcontrib><creatorcontrib>SHI MIN</creatorcontrib><title>Wafer fixing device and wafer coating equipment</title><description>The utility model discloses a wafer fixing device and wafer coating equipment, the wafer fixing device comprises a fixing disc and an adsorption device, the fixing disc is used for placing a wafer, and the adsorption device is arranged at the bottom end of the fixing disc; a plurality of notch grooves are formed in the outer side of the edge of the top end of the fixing disc, the notch grooves are evenly distributed in the fixing disc at equal intervals, notches are formed in the edge of the wafer, and the shapes of the notch grooves are matched with the shapes of the notches. The high-density plasma can be uniformly deposited and distributed on the wafer while the generation of the electric arc is avoided, so that the problem of wafer test failure caused by non-uniform deposition of the high-density plasma on the wafer chip is solved, and the coating quality of the wafer and the yield of the wafer are further improved.
本申请公开一种晶圆固定装置及晶圆镀膜设备，包括固定盘和吸附装置，固定盘用于放置晶圆，吸附装置设置于固定盘底端；固定盘的顶端边缘外侧设置有若干缺口槽，若干缺口槽在固定盘上均匀且等距分</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPT0xLLVJIy6zIzEtXSEkty0xOVUjMS1EoB4sn5yeWgCRSC0szC3JT80p4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RkYGZoaWBpWVoqDFRigBy_Sul</recordid><startdate>20240319</startdate><enddate>20240319</enddate><creator>LI-FENG YILANG</creator><creator>GUAN YAZHOU</creator><creator>LIU YANG</creator><creator>SHI MIN</creator><scope>EVB</scope></search><sort><creationdate>20240319</creationdate><title>Wafer fixing device and wafer coating equipment</title><author>LI-FENG YILANG ; GUAN YAZHOU ; LIU YANG ; SHI MIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220619099UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>LI-FENG YILANG</creatorcontrib><creatorcontrib>GUAN YAZHOU</creatorcontrib><creatorcontrib>LIU YANG</creatorcontrib><creatorcontrib>SHI MIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI-FENG YILANG</au><au>GUAN YAZHOU</au><au>LIU YANG</au><au>SHI MIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer fixing device and wafer coating equipment</title><date>2024-03-19</date><risdate>2024</risdate><abstract>The utility model discloses a wafer fixing device and wafer coating equipment, the wafer fixing device comprises a fixing disc and an adsorption device, the fixing disc is used for placing a wafer, and the adsorption device is arranged at the bottom end of the fixing disc; a plurality of notch grooves are formed in the outer side of the edge of the top end of the fixing disc, the notch grooves are evenly distributed in the fixing disc at equal intervals, notches are formed in the edge of the wafer, and the shapes of the notch grooves are matched with the shapes of the notches. The high-density plasma can be uniformly deposited and distributed on the wafer while the generation of the electric arc is avoided, so that the problem of wafer test failure caused by non-uniform deposition of the high-density plasma on the wafer chip is solved, and the coating quality of the wafer and the yield of the wafer are further improved.
本申请公开一种晶圆固定装置及晶圆镀膜设备，包括固定盘和吸附装置，固定盘用于放置晶圆，吸附装置设置于固定盘底端；固定盘的顶端边缘外侧设置有若干缺口槽，若干缺口槽在固定盘上均匀且等距分</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Wafer fixing device and wafer coating equipment |
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