Wafer fixing device and wafer coating equipment

The utility model discloses a wafer fixing device and wafer coating equipment, the wafer fixing device comprises a fixing disc and an adsorption device, the fixing disc is used for placing a wafer, and the adsorption device is arranged at the bottom end of the fixing disc; a plurality of notch grooves are formed in the outer side of the edge of the top end of the fixing disc, the notch grooves are evenly distributed in the fixing disc at equal intervals, notches are formed in the edge of the wafer, and the shapes of the notch grooves are matched with the shapes of the notches. The high-density plasma can be uniformly deposited and distributed on the wafer while the generation of the electric arc is avoided, so that the problem of wafer test failure caused by non-uniform deposition of the high-density plasma on the wafer chip is solved, and the coating quality of the wafer and the yield of the wafer are further improved. 本申请公开一种晶圆固定装置及晶圆镀膜设备，包括固定盘和吸附装置，固定盘用于放置晶圆，吸附装置设置于固定盘底端；固定盘的顶端边缘外侧设置有若干缺口槽，若干缺口槽在固定盘上均匀且等距分