Integrated circuit packaging structure

The utility model discloses an integrated circuit packaging structure which comprises a substrate, a first guide rail plate and a second guide rail plate are arranged on the substrate, the first guide rail plate is fixedly connected with the substrate, and the second guide rail plate and the first guide rail plate are arranged on one side of the first guide rail plate in a sliding mode and distributed in parallel. The packaging structure further comprises a driving device and a packaging tape roller, the packaging tape roller is arranged above the substrate, a packaging tape is wound on the packaging tape roller, one end of the packaging tape is guided through a guide wheel and packages the braid containing groove through the bonding face, the driving device can drive the braid to move, and the driving device drives the braid to move. The first guide rail plate and the second guide rail plate are in sliding fit and can be matched with braids with different widths; after the packaging belts are bonded with the