Wave-shaped cutter suitable for rubber bonding surface processing
The utility model discloses a wave-shaped cutter suitable for processing a rubber bonding surface. The wave-shaped cutter comprises a cutter body, a mounting hole is formed in an inner cavity of the cutter body, a cutter cutting edge is arranged on the right side of the top of the cutter body, an an...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a wave-shaped cutter suitable for processing a rubber bonding surface. The wave-shaped cutter comprises a cutter body, a mounting hole is formed in an inner cavity of the cutter body, a cutter cutting edge is arranged on the right side of the top of the cutter body, an anti-rust layer is arranged on the surface of the cutter body, and a wear-resistant and heat-resistant layer is arranged on the surface of the anti-rust layer. The anti-rust layer comprises an epoxy red lead paint layer, and the surface of the epoxy red lead paint layer is coated with an epoxy zinc-rich paint layer. By means of the raised grain machining tool, the surface of a machined product can be in a raised grain shape, the raised grains are beneficial to filling of an adhesive on the metal surface, then rubber and metal can be effectively bonded together, the roughness of the raised grain surface is stably changed by adjusting the machining depth of the tool in the machining process, and the machining quality o |
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