Dustproof structure of integrated circuit board
The utility model relates to the technical field of integrated circuit boards, in particular to an integrated circuit board dustproof structure which comprises an integrated circuit board base body, a shell is sleeved on the outer wall of the integrated circuit board base body, mounting plates are c...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of integrated circuit boards, in particular to an integrated circuit board dustproof structure which comprises an integrated circuit board base body, a shell is sleeved on the outer wall of the integrated circuit board base body, mounting plates are connected to the bottom ends of the outer walls of the two sides of the shell, and supporting plates are connected to the centers of the two sides of the inner wall of the shell. The inner wall of each supporting plate is connected with a plurality of rubber wire passing rings, the inner wall of each rubber wire passing ring is connected with a dustproof plug, the two ends of the top of the shell are connected with inserting plates, and the inner walls of the two ends of the top of each inserting plate are connected with bolts. The outer wall of the connecting line can be tightly attached to the outer wall of the connecting line, so that a good dustproof effect is achieved, normal heat dissipation of components on t |
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