Semiconductor chilling plate based on redundant structure

The utility model discloses a semiconductor chilling plate based on a redundant structure. A first layer plate and a second layer plate are oppositely arranged; the plurality of metal layer arrays are arranged on two opposite surfaces of the first laminate and the second laminate; the semiconductor layer is arranged between the first layer plate and the second layer plate, and the semiconductor layer is connected with the metal layer on the first layer plate and the metal layer on the second layer plate; every two P-type semiconductors are connected in parallel through a metal layer to form a P-type parallel unit; every two N-type semiconductors are connected in parallel through a metal layer to form an N-type parallel unit; and the P-type parallel units and the N-type parallel units are alternately connected in series through metal layers. Every two P-type semiconductors are connected in parallel to form a P-type parallel unit, every two N-type semiconductors are connected in parallel to form an N-type paral