Double-base-island series-connection internal insulation packaging structure of high-power semiconductor

The utility model discloses a double-base-island series-connection internal insulation packaging structure of a high-power semiconductor, which comprises a plastic packaging body, a base island slide glass, an insulation ceramic chip and a radiating fin, the insulation ceramic chip is welded on the radiating fin, the base island slide glass is welded on the insulation ceramic chip, and the base island slide glass is welded on the radiating fin. The plastic package body packages the base island slide glass, the insulating ceramic chip and the radiating fin together, the base island slide glass comprises double base islands, aluminum wires and a plurality of pins, and the double base islands are electrically connected with the plurality of pins through the aluminum wires. According to the utility model, the application range is wider, the heat of the chip can be fully led out due to the internal ceramic design, the size of the area of the radiating fin and the area of the copper foil of the PCB can be reduced,