Packaging structure of electrically controlled thyristor
The utility model relates to the technical field of thyristors, in particular to a packaging structure of an electric control thyristor, which comprises a cathode bottom plate, a ceramic shell is arranged at the upper end of the cathode bottom plate, an anode top plate is fixedly connected with the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of thyristors, in particular to a packaging structure of an electric control thyristor, which comprises a cathode bottom plate, a ceramic shell is arranged at the upper end of the cathode bottom plate, an anode top plate is fixedly connected with the upper end of the ceramic shell, and a thyristor chip is sleeved in the ceramic shell; the heat dissipation mechanism comprises a heat dissipation sheet embedded in the ceramic shell, and the inner side of the heat dissipation sheet is attached to the thyristor chip; and the assembling mechanism comprises a groove formed in the bottom end of the cathode bottom plate, and two sets of symmetrical movable blocks are clamped in the groove. According to the utility model, the heat dissipation mechanism is designed to cooperate with the assembly mechanism, so that the heat dissipated by the thyristor chip can be transmitted to other heat dissipation devices through the heat dissipation fins, the heat dissipation effect is |
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