Packaging structure of CMP silica gel adsorption film

The utility model provides a packaging structure of a CMP (Chemical Mechanical Polishing) silica gel adsorption film, which is characterized in that packaging units filled with the CMP silica gel adsorption film are horizontally stacked in a packaging box of which each surface is paved with a buffer...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HUI HONGYE, YAO LIJUN, ZHAO ZIYU, XU KANG, ZUO WEI, BAI JUNTIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!