Packaging structure of CMP silica gel adsorption film
The utility model provides a packaging structure of a CMP (Chemical Mechanical Polishing) silica gel adsorption film, which is characterized in that packaging units filled with the CMP silica gel adsorption film are horizontally stacked in a packaging box of which each surface is paved with a buffer...
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Format: | Patent |
Sprache: | chi ; eng |
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