Packaging structure of CMP silica gel adsorption film
The utility model provides a packaging structure of a CMP (Chemical Mechanical Polishing) silica gel adsorption film, which is characterized in that packaging units filled with the CMP silica gel adsorption film are horizontally stacked in a packaging box of which each surface is paved with a buffer...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides a packaging structure of a CMP (Chemical Mechanical Polishing) silica gel adsorption film, which is characterized in that packaging units filled with the CMP silica gel adsorption film are horizontally stacked in a packaging box of which each surface is paved with a buffer layer, and a buffer layer is arranged between every two adjacent packaging units filled with the CMP silica gel adsorption film; packaging strips are laid on the outer bottom face and the outer top face of the packaging box, the packaging unit provided with the CMP silica gel adsorption film comprises a blister packaging box containing the CMP silica gel adsorption film, and a packaging film is packaged on the outer side of the blister packaging box. The packaging structure of the CMP silica gel adsorption film can effectively prevent the problems of undesirable phenomena of packaging box damage, sinking, product damage, air leakage, deformation, scratches and the like in the express transportation process of prod |
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