Multi-layer circuit board automatic pressing device

The utility model discloses a multilayer circuit board automatic pressing device which comprises a bottom plate, supporting columns are welded at four corners of the top surface of the bottom plate, a top plate is welded at the top ends of the four supporting columns, a hydraulic oil cylinder is fixedly mounted on the bottom surface of the top plate through a mounting plate, and a supporting plate is mounted at the telescopic end of the hydraulic oil cylinder through the mounting plate. According to the utility model, the positioning rod, the positioning plate, the buffer pad, the positioning block and the buffer spring are matched for use, so that in the process of pressing the circuit board, on one hand, the circuit board is fixed in an auxiliary manner, the problem of deviation of the circuit board in the pressing process is avoided, and the pressing precision of the circuit board is ensured; on the other hand, a buffering process is provided in the process that the circuit board is pressed, the situation