Cutting machine and assembly line

The embodiment of the utility model relates to the technical field of semiconductor processing, and discloses a cutting machine and an assembly line, the cutting machine comprises a mounting frame, a lamination pressing table, a knife rest and a cutting assembly, and the lamination pressing table is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU CANGHAI, YASUMASA, QI JIANLIANG, CUI MINGXUE
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The embodiment of the utility model relates to the technical field of semiconductor processing, and discloses a cutting machine and an assembly line, the cutting machine comprises a mounting frame, a lamination pressing table, a knife rest and a cutting assembly, and the lamination pressing table is arranged on the mounting frame; one end of the knife rest is arranged on the mounting frame; the cutting assembly comprises a cutter bar, a blade and a fastener, the cutter bar is arranged at the other end of the cutter rest, a first through hole is formed in the blade, a second through hole is formed in the end portion of one end of the cutter bar, and the fastener penetrates through the first through hole and is detachably fixed to the second through hole. By means of the mode, the blade can be replaced more conveniently and quickly, and the cost is lower compared with the cost of replacing the whole cutting assembly. 本申请实施例涉及半导体加工技术领域,公开了一种切割机以及流水线,所述切割机包括安装架、叠层压台、刀架和切割组件,所述叠层压台设置于所述安装架;所述刀架其一端设置于所述安装架;所述切割组件包括