Frame packaging structure

The utility model discloses a frame packaging structure, comprising a heat radiation backboard, a frame body and a plastic packaging body, the frame body is provided with a slide holder, the back surface of the slide holder is connected with the front surface of the heat radiation backboard, the front surface of the slide holder is provided with a chip, and the plastic packaging body wraps the outer sides of the slide holder, the chip and the heat radiation backboard. A first insulation heat conduction layer is arranged on the back face of the slide holder, the surface of the side, away from the slide holder, of the first insulation heat conduction layer is connected with the front face of the heat dissipation backboard, a second insulation heat conduction layer is arranged on the front face of the slide holder, and a third insulation heat conduction layer is arranged on the upper surface and/or the side surface of the slide holder. The first insulation heat conduction layer is connected with the second insul