Semiconductor test socket
The utility model relates to the technical field of semiconductor test sockets, and discloses a semiconductor test socket which comprises a base, a cover body is arranged at the top of the base, a fixing groove is formed in the middle of the top side of the base, and a spring assembly is fixedly ins...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of semiconductor test sockets, and discloses a semiconductor test socket which comprises a base, a cover body is arranged at the top of the base, a fixing groove is formed in the middle of the top side of the base, and a spring assembly is fixedly installed on the bottom side in the fixing groove. A semiconductor test placement seat is fixedly installed above the spring assembly, and pressing mechanisms are arranged on the two sides of the top of the fixing groove. According to the utility model, through the arrangement of the cover body and the gas channels, a semiconductor chip is firstly fixed on the semiconductor test placement seat through the pressing mechanism during use, the fan and the electric heating wire can be started, hot air is conveyed into the cover body through one of the gas channels, and then the hot air enters the fixing groove through the third gas channel; and then the gas enters the cavity through the other gas channel and is exhausted f |
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