Semiconductor chip packaging and positioning mechanism

The utility model relates to a semiconductor chip packaging positioning mechanism which comprises a double-shaft air cylinder, a positioning plate is fixedly installed at the output end of the double-shaft air cylinder, positioning assemblies are arranged at the ends of the positioning plate, each p...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SUN XIAOZHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS PACKING PERFORMING OPERATIONS STORING TRANSPORTING UNPACKING
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