Semiconductor chip packaging and positioning mechanism

The utility model relates to a semiconductor chip packaging positioning mechanism which comprises a double-shaft air cylinder, a positioning plate is fixedly installed at the output end of the double-shaft air cylinder, positioning assemblies are arranged at the ends of the positioning plate, each positioning assembly comprises a sliding rod and a contact head, the sliding rods penetrate through the positioning plate, and the contact heads are arranged on the sliding rods. A spring is installed between one end, located below the positioning plate, of the sliding rod and the bottom surface of the positioning plate, the other end of the sliding rod is fixedly connected with a contact head, the contact head is attached to the upper surface of the positioning plate, a signal receiver is fixedly installed at the center of the outer wall above the positioning plate, and the signal receiver is electrically connected with a detection head in the direction facing the end of the positioning plate. The contact heads at