Mechanical arm for adsorbing wafer

The utility model provides a mechanical arm for adsorbing wafers, and relates to the field of semiconductor automation equipment, the mechanical arm comprises a mechanical arm body, the end part of the mechanical arm body is provided with a plurality of vacuum adsorption structures, each vacuum adsorption structure comprises a vacuum adsorption point and a sealing ring, and the upper edge of each sealing ring is one end deviating from the mechanical arm body. The upper edge of the sealing ring is higher than the vacuum adsorption point; the diameter of the vacuum adsorption area is 8-12mm; and when the mechanical arm body adsorbs the wafer, the adsorption forces of the plurality of vacuum adsorption structures jointly act on the wafer. The multiple vacuum adsorption structures are arranged, the sizes of the vacuum adsorption structures are reduced, the adsorption force generated by a single vacuum adsorption structure on the wafer is effectively reduced, the wafer generates small deformation under the conditi