Universal printed circuit board and universal packaging board

The utility model discloses a universal printed circuit board and a universal packaging board which are used for packaging main control chips of at least two specifications, and at least one part of bonding pads of the main control chips of the two specifications are universal bonding pads. The two...

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Bibliographische Detailangaben
Hauptverfasser:	GU HONGWEI, CHENG CAOFEI, QIU QIONGQIONG, HU XIAOHUI, TANG YOUYUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The utility model discloses a universal printed circuit board and a universal packaging board which are used for packaging main control chips of at least two specifications, and at least one part of bonding pads of the main control chips of the two specifications are universal bonding pads. The two main control chips are respectively provided with a first special bonding pad and a second special bonding pad; the universal printed circuit board comprises a plurality of golden fingers, and the plurality of golden fingers are arranged in rows; wherein the plurality of golden fingers comprise a universal golden finger, a first special golden finger and a second special golden finger, and the number of the golden fingers is greater than the number of bonding pads of the main control chip; the universal golden finger is matched with the universal bonding pad; the first special golden finger is matched with the first special bonding pad; the second special golden finger is matched with the second special bonding pad