Double-layer heat dissipation module
The utility model discloses a double-layer heat dissipation module which comprises a partition plate, fan assemblies, heat dissipation fins and heat conduction pipes, the two sides of the partition plate are respectively provided with one fan assembly, the two fan assemblies are respectively provide...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a double-layer heat dissipation module which comprises a partition plate, fan assemblies, heat dissipation fins and heat conduction pipes, the two sides of the partition plate are respectively provided with one fan assembly, the two fan assemblies are respectively provided with a first air opening and a second air opening facing the same side edge of the partition plate, one of the first air opening and the second air opening is used for air suction, and the other one is used for air exhaust. The second air openings of the two fan assemblies are each externally provided with a heat dissipation fin, one end of the heat pipe is clamped between the two heat dissipation fins, and the other end of the heat pipe extends out of the position between the two heat dissipation fins and is used for being attached to a heat release source. The radiating device is more compact in structure while high-efficiency radiating of the radiating device is guaranteed.
本实用新型公开一种双层散热模组,包括隔板、风扇组件、散热翅片和热导管,隔 |
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