Water pump mechanism of integrated circuit lead frame electroplating equipment

The utility model relates to the technical field of water pumps, in particular to a water pump mechanism of integrated circuit lead frame electroplating equipment, which comprises a power part and a driving part, the power part comprises a driving motor and a driving shaft arranged at the driving en...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YI, HONG GI, SU QIAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of water pumps, in particular to a water pump mechanism of integrated circuit lead frame electroplating equipment, which comprises a power part and a driving part, the power part comprises a driving motor and a driving shaft arranged at the driving end of the driving motor, and the driving part comprises a pump body connected with the driving motor; a sealing disc is installed at the top of the pump body, a gap exists between the sealing disc and the driving motor, the driving shaft is provided with an air exhaust fan blade located between the sealing disc and the driving motor, and the air exhaust fan blade rotationally discharges water vapor near the driving end of the driving motor in the direction away from the driving motor. When the driving shaft rotates, the pump body works, some liquid vapor floats near the driving end of the driving motor, the driving shaft is coaxially provided with the exhaust fan blades, and the exhaust fan blades can synchronously