Light and thin HDI high-density circuit board

The utility model discloses a light and thin HDI high-density circuit board, which comprises a circuit layer, an insulating layer is arranged at the lower part of the circuit layer, a heat dissipation layer is arranged at the lower part of the insulating layer, a substrate is arranged at the lower p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAN RENZHENG, HU YANGYUE, HU YANGPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PRINTED CIRCUITS SEPARATION TRANSPORTING
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