Light and thin HDI high-density circuit board

The utility model discloses a light and thin HDI high-density circuit board, which comprises a circuit layer, an insulating layer is arranged at the lower part of the circuit layer, a heat dissipation layer is arranged at the lower part of the insulating layer, a substrate is arranged at the lower p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PAN RENZHENG, HU YANGYUE, HU YANGPING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a light and thin HDI high-density circuit board, which comprises a circuit layer, an insulating layer is arranged at the lower part of the circuit layer, a heat dissipation layer is arranged at the lower part of the insulating layer, a substrate is arranged at the lower part of the heat dissipation layer, and mounting groove plates are mounted on two sides of the circuit layer and the substrate. A filter screen sleeve is arranged between the circuit layer and the base plate, frame plates are pasted on the surfaces, away from each other, of the circuit layer and the base plate, the two sides of the surfaces, away from each other, of the two frame plates are welded to the inner top surfaces and the inner bottom surfaces of the two mounting groove plates correspondingly, and multiple mounting holes are formed in the upper portions of the two mounting groove plates; and a plurality of groups of heat dissipation holes are formed in the far surfaces of the two groups of mounting groove p