Gas protection device of full-automatic chip wire bonding machine

The utility model relates to the technical field of chip packaging and bonding, and discloses a gas protection device of a full-automatic chip wire bonding machine, which comprises a protection box and a hollow block, the left side and the right side of the inner wall of the protection box are respe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI ZHILIANG, QIU NAIJUN, QIU PINGLIANG, PENG TIANYUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of chip packaging and bonding, and discloses a gas protection device of a full-automatic chip wire bonding machine, which comprises a protection box and a hollow block, the left side and the right side of the inner wall of the protection box are respectively provided with a chute I, and the left side and the right side of the top of the rear end of the protection box are respectively and fixedly connected with a synchronous motor; the output ends of the synchronous motors penetrate through the first sliding grooves and are fixedly connected with threaded rods, the outer walls of the multiple threaded rods are in threaded connection with moving blocks, and the adjacent sides of the multiple moving blocks are fixedly connected with connecting plates. According to the device, the synchronous motor is controlled to enable the moving blocks on the two sides to drive the connecting plate to move front and back, then the micro motor is controlled to control the gear t