Semiconductor structure

The utility model provides a semiconductor structure. An assembly including at least one semiconductor die and an interposer is provided. A package substrate including a substrate bonding pad is provided. The package substrate includes a first horizontal surface facing the assembly, a second horizon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIANG YUMIN, HOU HAOCHENG, WANG ZONGDING, ZHENG RONGWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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