Semiconductor structure

The utility model provides a semiconductor structure. An assembly including at least one semiconductor die and an interposer is provided. A package substrate including a substrate bonding pad is provided. The package substrate includes a first horizontal surface facing the assembly, a second horizontal surface on opposite sides of the first horizontal surface, and an opening extending between the first horizontal surface and the second horizontal surface. The assembly is bonded to the package substrate by partially bonding a first solder material to a respective one of the substrate bond pads and a respective one of the first interposer bond pads on the interposer. According to the utility model, the lateral range of the bottom filling glue material can be reduced, and the packaging retreat distance can be reduced. 本实用新型提供一种半导体结构。提供一种包括至少一个半导体管芯及中介层的组装件。提供一种包括衬底接合垫的封装衬底。封装衬底包括面对组装件的第一水平表面、位于第一水平表面的相对的侧上的第二水平表面、以及在第一水平表面与第二水平表面之间延伸的开口。组装件是通过将第一焊料材料部分接合至衬底接合垫中的相应一者及位于中介层上的第一中介层接合垫中的相应一者而贴合至封装衬底。本实用新型可以减小底部填充胶材料