Pad protection structure of Mini LED flexible substrate

The utility model discloses a bonding pad protection structure of a Mini LED flexible substrate, which belongs to the field of bonding pad structures and comprises a thick copper wire and a thin copper wire crossed with the thick copper wire, a bonding pad is arranged at the crossed position of the thick copper wire and the thin copper wire, an ink layer is arranged on the surface of the bonding pad, a PI layer is arranged between the ink layer and the bonding pad, and the PI layer is arranged between the thick copper wire and the thin copper wire. The PI layer is attached to the outer portion of the bonding pad through the adhesive layer, the thickness of the PI layer is 12.5 microns, the thickness of the adhesive layer is 15 microns, the size of the PI layer is larger than that of the ink layer, a window is formed in the center of the PI layer, the area of the windowing area of the PI layer is 1-2 mm * 1-2 mm, the thickness of the ink layer is 10-30 microns, the area of the ink layer is 1-2 mm * 1-2 mm, and