Multi-line multi-layer flexible substrate

The utility model discloses a multi-line multi-layer soft substrate, which comprises at least two layers of substrates which are stacked in sequence and is also provided with a connecting plate, the side surface of the connecting plate is provided with a card insertion concave cavity, and the edges of the substrates are inserted into the card insertion concave cavity and are fixed through an adhesive layer; circuits are arranged on the top surfaces of the substrates, insulating layers are fixed between the adjacent substrates through adhesive layers, conductive jacks are formed in the insulating layers, conductive thimbles used for penetrating through the conductive jacks are arranged on the substrates, the adjacent substrates are stacked, and the conductive thimbles penetrate through the conductive jacks to enable the adjacent substrates to be electrically connected. According to the utility model, the structure arrangement is reasonable, the multilayer substrates are arranged, and the connecting plates are