Semiconductor package

The utility model provides a semiconductor package comprising a cooling system. The semiconductor package can comprise an intermediate layer, one or more package assemblies jointed to the intermediate layer, a packaging body on the intermediate layer, and the cooling system above the one or more package assemblies. The cooling system may include one or more metal layers on a top surface of the one or more package components, first metal pins on the one or more metal layers, second metal pins, where each second metal pin may be bonded by solder to a corresponding one of the first metal pins, and a first cover over the second metal pin, wherein the first cover may include an opening. 本实用新型提供一种包括冷却系统的半导体封装，半导体封装可包括中介层、接合到中介层的一个或多个封装组件、中介层上的包封体、以及一个或多个封装组件上方的冷却系统。冷却系统可以包括在一个或多个封装组件的顶表面上的一个或多个金属层、一个或多个金属层上的第一金属引脚、第二金属引脚，其中每个第二金属引脚可以通过焊料接合到对应的一个第一金属引脚，以及在第二金属引脚上方的第一盖体，其中第一盖体可以包括开口。