Multi-layer heat insulation and oxygen reduction structure and device for single crystal furnace
The utility model discloses a multilayer heat insulation and oxygen reduction structure and a multilayer heat insulation and oxygen reduction device for a single crystal furnace, relates to the technical field of monocrystalline silicon manufacturing, and at least can partially solve the problem of...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a multilayer heat insulation and oxygen reduction structure and a multilayer heat insulation and oxygen reduction device for a single crystal furnace, relates to the technical field of monocrystalline silicon manufacturing, and at least can partially solve the problem of poor heat insulation and oxygen reduction effects of a single-layer heat insulation and oxygen reduction structure in the prior art. The multi-layer heat insulation and oxygen reduction structure for the single crystal furnace comprises a bottom-layer arc supporting plate and a bottom-layer arc heat insulation plate which are coaxially arranged and fixedly connected, the bottom-layer arc heat insulation plate is positioned right above the bottom-layer arc supporting plate, and the multi-layer heat insulation and oxygen reduction structure further comprises a top-layer arc heat insulation plate which is coaxially arranged and fixedly connected with the bottom-layer arc heat insulation plate.
本实用新型公开了一种单晶炉用的多层隔热降氧结构及 |
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