Heat dissipation device of piezoelectric relay body

The utility model provides a heat dissipation device of a piezoelectric relay body, which comprises a bottom plate, a support plate for supporting the relay body is arranged above the bottom plate, the support plate is connected with the bottom plate through a support column, and a heat dissipation cavity is formed between the bottom plate and the support plate; fixing supports for fixing a relay body are arranged above the supporting plate, mounting holes matched with the fixing supports are formed in the supporting plate, the fixing supports are connected through the mounting holes, heat dissipation holes are formed in the portion, in the fixing supports, of the supporting plate, and heat conduction plates for supporting the relay body are arranged in the heat dissipation holes. A plurality of radiating fins are arranged in the radiating cavity below the heat conducting plate, the upper parts of the radiating fins are connected with the heat conducting plate, and the lower parts of the radiating fins are co