Ultra-thin single-point COB (Chip On Board) lamp strip

The utility model discloses an ultra-thin single-point COB lamp strip which comprises an FPC board, a plurality of LED wafers are arranged on the upper surface of the FPC board at intervals in the length direction of the FPC board, and fluorescent silica gel is sprayed on the LED wafers. Firstly, a...

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Bibliographische Detailangaben
1. Verfasser:	QIU GUOLIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	The utility model discloses an ultra-thin single-point COB lamp strip which comprises an FPC board, a plurality of LED wafers are arranged on the upper surface of the FPC board at intervals in the length direction of the FPC board, and fluorescent silica gel is sprayed on the LED wafers. Firstly, a traditional mode that silica gel is arranged in a whole strip is abandoned, a plurality of LED wafers are arranged on the upper surface of the FPC board at intervals in the length direction of the FPC board, and then fluorescent silica gel is sprayed on each LED wafer, so that compared with a traditional glue pulling mode, the cost of a glue dispensing mode is lower, the production efficiency can be improved, and meanwhile the lamp strip is more convenient to bend; the fluorescent powder is closer to the light-emitting chip, so that the brightness is higher, and the lighting effect is better improved; meanwhile, a rectifier bridge is arranged on the FPC board, so that the FPC board can be directly connected with a