Semiconductor component adhesive residue removing equipment

The utility model provides a semiconductor component adhesive residue removing device, which relates to the technical field of semiconductor manufacturing, and comprises a box body, the inner surface of the box body is fixedly connected with a guide rail, the outer surface of the guide rail is slidably connected with a base, the outer surface of the base is fixedly connected with a bin door, and the outer surface of the box body is provided with a material removing port. According to the utility model, the semiconductor component is arranged on the pressing plate, the pressing plate slides in the limiting box through the gravity of the pressing plate and compresses the spring I, and in the moving process of the pressing plate, the buckle moves in the curved groove through the limiting column until the buckle clamps the periphery of the semiconductor component, so that the semiconductor component cannot be loosened and can be quickly fixed, assembled and disassembled, and the glue removing efficiency is improv