Double-spigot structure of bone conduction earphone
The utility model relates to the technical field of bone conduction earphone assembly, in particular to a double-seam-allowance structure of a bone conduction earphone, which comprises a first bin body and a second bin body, the first bin body and the second bin body are connected to form a bin body...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of bone conduction earphone assembly, in particular to a double-seam-allowance structure of a bone conduction earphone, which comprises a first bin body and a second bin body, the first bin body and the second bin body are connected to form a bin body, a seam allowance structure is arranged at the joint of the first bin body and the second bin body, and the seam allowance structure comprises a concave part and a convex part; the protruding part is inserted into the sunken part, a glue hiding gap used for storing external glue is formed between the protruding part and the inner wall of the sunken part, and at least one glue overflowing channel communicated with the interior of the bin body is formed in the side, close to the interior of the bin body, of the sunken part. The protruding part is inserted into the concave part, the outer side of the concave part abuts against the protruding part, so that one side of the surface of the bin body is sealed, redundant g |
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