Heat dissipation device suitable for MOS (Metal Oxide Semiconductor) tube

The utility model discloses a heat dissipation device suitable for an MOS transistor, and relates to the technical field of MOS transistors, the heat dissipation device comprises an MOS transistor and a heat dissipation mainboard, the outer walls of the left side and the right side of the MOS transistor are fixedly provided with electrodes, the outer walls of the two sides of the bottom of the heat dissipation mainboard are fixedly provided with heat dissipation fixing plates, the outer walls of the inner sides of the heat dissipation fixing plates are in lap joint with the outer walls of the front side and the rear side of the MOS transistor, and the outer walls of the inner sides of the heat dissipation fixing plates are in lap joint with the heat dissipation mainboard. A heat conduction plate is fixedly installed at the middle end of the inner wall of the heat dissipation mainboard, and the outer wall of the bottom of the heat conduction plate is evenly and fixedly coated with heat conduction silicone grea