Printed circuit board (PCB)
The utility model provides a PCB (Printed Circuit Board), which comprises a solder paste layer printed on the surface of a bonding pad and a reserved via hole, and the solder paste layer is not in contact with the reserved via hole. According to the utility model, through hole avoiding design is ado...
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Format: | Patent |
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Zusammenfassung: | The utility model provides a PCB (Printed Circuit Board), which comprises a solder paste layer printed on the surface of a bonding pad and a reserved via hole, and the solder paste layer is not in contact with the reserved via hole. According to the utility model, through hole avoiding design is adopted, so that soldering paste can avoid through holes when steel mesh brush printing is carried out; when reflow soldering is carried out, it is guaranteed that soldering paste does not flow into the via holes on the basis that electrical connection is completed, then the problems of tin leakage, insufficient soldering, poor soldering and the like of the bonding pad are solved, meanwhile, bonding pad windowing types of different sizes can be compatible, cost is low, and the method is more suitable for batch production of electronic products.
本实用新型提出了一种PCB板,包括:印刷在焊盘表面的锡膏层,以及预留过孔,所述锡膏层与所述预留过孔非接触。本实用新型采用了过孔避让的设计,在进行钢网刷印时,使得焊锡膏避开过孔;且在进行回流焊接时,在完成电气连接的基础上保证了焊锡膏不会流入过孔,进而解决了焊盘漏锡、虚焊、焊接不良等问题,同时能够兼容不同尺寸的焊盘开窗类型,成本较低且更适用于电子产品的批 |
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