Wafer conduction sheet assembly and integrated circuit structure

The utility model discloses a wafer conduction sheet assembly and an integrated circuit structure. The wafer conduction sheet assembly comprises a first conduction sheet and a second conduction sheet, the first conduction sheet comprises a first electrode connection part and a plurality of first signal transmission parts. Two opposite surfaces of the first electrode connection part are respectively provided with a first protruding area and a first recessed area. The first protruding region is for contacting the first electrode. The second conduction sheet is electrically isolated from the first conduction sheet, the second conduction sheet comprises a second electrode connecting part and a second signal transmission part, two opposite surfaces of the second electrode connecting part are respectively provided with a second protruding area and a second concave area, the second protruding area is used for contacting with the second electrode, and the second concave area is used for contacting with the second sig