Lead frame feeding mechanism of chip-type laminated solid aluminum electrolytic capacitor
The utility model relates to the technical field of capacitor production devices, in particular to a lead frame feeding mechanism of a chip-type laminated solid aluminum electrolytic capacitor, which comprises a material platform and a feeding track, the feeding track is vertically mounted on the ma...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of capacitor production devices, in particular to a lead frame feeding mechanism of a chip-type laminated solid aluminum electrolytic capacitor, which comprises a material platform and a feeding track, the feeding track is vertically mounted on the material platform, and a liftable lead frame placing frame and a transfer support are vertically mounted at the top of the material platform. A lead frame placing frame is arranged on the lead frame placing frame, a transferring mechanism is arranged on the lead frame placing frame, a transferring head of the transferring support is connected with a mounting plate, a plurality of vacuum suction nozzles communicated with external vacuum equipment are arranged on the mounting plate, and the vacuum suction nozzles are used for adsorbing the lead frame. Then the lead frame is placed on the feeding track, multi-point suction material taking of the multiple vacuum suction nozzles is achieved, the characteristics that the l |
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